Prediction and verification of wafer surface morphology in ultrasonic vibration assisted wire saw (UAWS) slicing single crystal silicon based on mixed material removal mode

Wafer Slicing and Wire Saw Manufacturing Technology

Wire saw, with its ability to cut very thin wafers from large diameter crystalline ingots of semiconductor materials, has emerged as a leading technology for wafer production in semiconductor and photovoltaic industry. Nevertheless, the wire saw cutting process remains lacking a theoretical methodology and is not properly understood. The modern times compulsion of more accurate and efficient ma...

Prediction of Surface Tension in Single and Mixed Electrolyte Solutions

Vibration-assisted machining of single crystal

Vibration-assisted machining offers a solution to expanding needs for improved machining, especially where accuracy and precision are of importance, such as in micromachining of single crystals of metals and alloys. Crystallographic anisotropy plays a crucial role in determining on overall response to machining. In this study, we intend to address the matter of ultra-precision machining of mate...

Wafer-bonded single-crystal silicon slot waveguides and ring resonators

We fabricated horizontal Si slot waveguides with a 25 nm SiO2 slot layer by bonding thin Si-on-insulator wafers. After removing the Si substrate and buried oxide from one side of the bonded structure, grating-coupled waveguides and ring resonators were partially etched into the Si /SiO2 /Si device layers. The gratings exhibit efficiencies of up to 23% at 1550 nm and the ring resonators were mea...

on the status of mixed methods research in applied linguistics

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